Formula and technology of plastic electroplating-ceramic electroplating

Formula and technology of plastic electroplating-ceramic electroplating.
Huizhou Boluo Tenglong Technology Co., Ltd. serves you wholeheartedly! Mainly engaged in plastic hydroelectroplating processing, with plastic injection molding processing, mold processing and so on!
Teach you the formula and technology of ceramic electroplating that are so beautiful that you have no friends.
1 Deoiling and degreasing agent sodium carbonate 20g/L sodium phosphate l0g/L OP emulsifier 2g/L.
Add water to lL.
Process conditions: temperature 80%, time 20~30min.
2 surface coarsening sulfuric acid l25mL/ hydrofluoric acid 125mL/L chromic anhydride 65g/L.
Process conditions: temperature, room temperature, time 2-3min.
3 3 sensitization.
4 stannous chloride dihydrate l0-20g/L.
5 hydrochloric acid l0-20g/L.
6 water to 1L.
7 process conditions: pH > 1, temperature at room temperature, time 5~10min.
8 4 activation.
9 palladium chloride 24g/L heptahydrate.
10 sodium hypophosphite monohydrate 24g/L.
11 Sodium citrate 5g/L.
12 lactic acid (catalytic accelerator) 27g/L.
13 Water is added to 1L.
14 process conditions: ph value 7-8, temperature 80-85 ℃, time 3-5min.
After the ceramic tool carries on the above pretreatment and then carries on the electroless nickel plating, the coating which is uniform and firmly bonded with the substrate can be obtained.
15 Bright nickel plating on ceramics.
16 Nickel sulfate heptahydrate 300.00g/L.
17 Sodium Chloride 15.00g/L.
18 boric acid 35.00g/L.
19 sodium sulfate decahydrate 70.00g/L.
20 saccharin 0.80g/L.
1,4-butynediol 2.00g/L.
Sodium dodecyl sulfate 0.08g/L.
Add water to 1.00L.
The process conditions are as follows: ph 5.5, temperature 40 ℃, time 60min, current density 2-4A/dm2, anode nickel sheet rolled into a tube.
Passivation solution.
Chromic anhydride 90g/L.
Concentrated sulfuric acid 16mL/L.
Sodium chloride 4g/L.
Process conditions: time 0.5min, temperature is room temperature.
After nickel plating, 1-2min is washed with clean water and passivated in passivation solution to obtain bright, smooth, strong adhesion and wear-resistant silver coating.
Formula l Silver paste for Burning and infiltration treatment of Ceramics before plating.
20 parts of silver oxide.
1 part of lead borate.
8 parts of rosin-turpentine solution.
The products coated with silver paste will be pre-baked l0~15min at 80100 ℃. The aim is to volatilize the rosin and turpentine first, so as not to produce a scaly silver layer at high temperature. After pre-drying, the products were transferred to muffle furnace and gradually heated to 200C to keep l0-15min. The heating rate should not be too fast. The temperature should be raised to 500 Mel 650 ℃ in about 1 hour, and the heat preservation 25-30min should be kept. The silver layer is not firmly bonded if the temperature is too low, and too high temperature is disadvantageous to the matrix. After the burning and infiltration is completed, when the furnace is cooled to 50 ℃, the product is removed and cooled to room temperature.
After silver infiltration, the surface of the ceramic products has been covered with a conductive silver layer, and then electroplating can be carried out. In order to ensure the quality of the silver layer, silver infiltration treatment can be used for 2 or 3 times.
At present, electroplating on ceramics and glass is mostly used in the electronic industry. Because of their high dielectric constant, the capacitors have the advantages of small size, good stability and low expansion coefficient, so they have been widely used.
Preparation of rosin-turpentine solution: take 1 part of rosin into fine powder, add 3 parts of 2-Mel turpentine, heat and evaporate under continuous stirring to the relative density of 0.935 Mel 0.936, store in bottle and set aside.
Formula 2 chemical coarsening treatment of glazed ceramics.
Hydrofluoric acid 200mL.
Nitric acid 600mL.
Process conditions: temperature, room temperature, time 3-5min.
In order to obtain the coating with good adhesion on the glazed ceramic substrate, it must be treated by sandblasting, chemical coarsening, sensitization and activation before plating.
Formula 3 Chemical coarsening treatment of plain fired ceramics before plating.
Chromic anhydride 50-60g.
Hydrofluoric acid 100-l25mL.
L00~1255mL sulfate.
Process conditions: temperature, room temperature, time 3-5min.
In order to obtain the coating with good adhesion on the plain-fired ceramic substrate, the coating must be treated by chemical coarsening, sensitization and activation before plating.
Formula 4 cyanide-free copper plating on ceramics.
Sodium pyrophosphate 28g/L.
Potassium pyrophosphate l40g/L.
Copper sulfate 50g/L.
Ammonium citrate l3g/L.
The process conditions are as follows: current density 1A/dm2, pH value 8.5, anode pure copper sheet, temperature 30 min 40 ℃, time 30min, continuous stirring is needed.
The ceramic plating first forms a smooth and smooth dark red copper film on the ceramic surface by electroless copper plating, and the copper film is thickened by electroplating copper to form a coating with light red, dense crystallization, strong adhesion, high hardness and cold and heat resistance.
Ceramic plating metallization.
Ceramic metallization is to firmly adhere a layer of metal film to the ceramic surface to realize the welding between ceramics and metals. a variety of ceramic metallization processes can be used, such as molybdenum-manganese method, silver paste method, gold plating method, platinum plating, copper plating method, tin plating method, nickel plating method and so on.
Large foreign companies such as Murata, Panasonic, Kyoto Ceramics and Motorola have been driving directly into the Chinese market. In order to meet these requirements, through active and unremitting efforts, we have finally successfully broken through the technical bottleneck and have our own exclusive technology.