Plastic Plating-electroless Copper Plating

Plastic plating-electroless copper plating.
Huizhou Boluo Tenglong Technology Co., Ltd. serves you wholeheartedly! Mainly engaged in plastic hydroelectroplating processing, with plastic injection molding processing, mold processing and so on!
In 1947, electroless copper plating was first reported by Narcus. Commercial electroless copper plating appeared in the 1950s, and the first modern electroless copper plating solution was published by Cahill in 1957; the bath is alkaline copper tartrate bath with formaldehyde as reducing agent. At the end of 1950s, the printed circuit board (double panel) required electroless copper plating through hole connection to replace the hollow rivet process at that time, which provided a huge market for electroless copper plating technology. Through the development and research of many scientists, the technology of electroless copper plating made great progress in the 1960s. The main achievements are as follows:
Successful Development of Colloidal Sn-Pd Commercial Technology.
In addition to tartrate, complexing agents such as EDTA and alkyl ethanolamine were also used.
A series of effective stabilizers were found, which significantly improved the stability of electroless copper plating solution.
The technology of electroless copper plating has matured in the 1970s, forming a series of commercial scale of thin copper plating, pattern plating, additive thick copper plating and plastic plating on printed circuit boards, and the electroless copper plating solution is very stable. there is a fully automatic control production line for bath analysis and adjustment. The development of high and new technology in the 1980s controls the technical direction of the printed circuit industry, and the market requires high precision, high-level number and high performance of the printed circuit board. With the development of high-level number and high density of multi-layer printed circuits, hole metallization has become one of the central May Day sections of printed circuit manufacturing; in order to ensure the reliability of products, the performance of electroless copper coating, especially the tensile strength and ductility put forward very stringent requirements. The electroless copper plating in this period still adopts the classical process form; however, great innovations have taken place in the control technology of process materials in terms of content and level. At present, electroless copper plating not only keeps the bath stable for a long time under wide operating conditions, but also the process state can be predicted and the coating performance is excellent. Some electroless plating has an aperture 0.15mm, the ratio of thickness to aperture is 10:00, the average coating is 65 μ m, and the thickness ratio is 100%; when the tensile strength is 400MPa, the ductility is more than 10%; and some coatings have ductility as high as 15%. Due to the inherent shortcomings of formaldehyde, many people begin to use hypophosphite, hydrazine or boron compounds as reducing agents instead. Electroless copper plating has experienced development and great progress in the history of more than 30 years, and has become a relatively new field, contributing to the reliability of electronic products and enriching people's lives. Due to the factors of environment and price, other metallization methods instead of electroless copper plating have been studied, and the amount of electroplating for plastic decoration has been significantly reduced due to the change of environment and customer taste, but the electroless copper plating market for radio frequency and magnetic shielding (EMI) is promising. Electroless copper plating in a new generation of multilayer printed circuits in the 21st century? The application of integrated board (BUM) in microelectronics industry is still under development.