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Jun 08, 2024

A Brief History Of Plastic Electroplating-Electroless Plating

A brief History of plastic Electroplating-Electroless plating.
Huizhou Boluo Tenglong Technology Co., Ltd. serves you wholeheartedly! Mainly engaged in plastic hydroelectroplating processing, with plastic injection molding processing, mold processing and so on! .
The development history of electroless plating is mainly the development history of electroless nickel plating. Although A.Wurtz discovered that hypophosphite reduced nickel in aqueous solution as early as 1844, the founders of electroless nickel plating were A.Brenner and G.Ridell of the American National Bureau of Standards. In 1947, they proposed the method of depositing non-powdered nickel and clarified the catalytic characteristics of the coating, which made it possible for the industrial application of electroless nickel plating technology. Therefore, the history of electroless nickel plating technology is still very short, and the real large-scale industry was in the late 1970s. In the early stage, there was only a medium phosphorus coating containing 5% Mui 8% (by weight) of phosphorus. initially developed a high phosphorus amorphous coating with a phosphorus content of 9% Mui 12%, which made electroless nickel plating a step forward. Developed a low-phosphorus coating with a phosphorus content of 1% Mel 4% from the late 1990s to the early 1990s. The physical electroless plating properties of the coatings with different phosphorus content are also different. The earliest industrial application of electroless nickel plating was in the United States General Transportation Company (GATC) after World War II. After a systematic study of the technology, they established the first production line in 1955 and developed an electroless nickel plating solution with the trade name "Kanigen" (short for Catalytic Nickel Gene Ration). In the 1970s, the Durnicoat process still using sodium hypophosphite as reducing agent and the Nibodur process with sodium borohydride as reducing agent Ni-B layer were developed, and then the method of electroless nickel plating with hydrazine as reducing agent appeared.

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