Plastic plating-Electroplating products used in the electronics and computer industry.
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Electroless nickel plating is the most widely used in the electronic and computer industry, involving almost every electroless nickel plating technology and process. Many new electroless nickel plating processes and materials are developed according to the needs of the development of electronic and computer industry. In terms of technical performance, it requires not only corrosion resistance and wear resistance, but also weldability, anti-diffusivity, electrical and magnetic properties.
Some countries have established laws and regulations that electronic equipment must be shielded to prevent electromagnetic and radio frequency interference. The plastic shell of electronic equipment is coated with copper and then electroless nickel, which is recognized as one of the most effective shielding methods. Electroless nickel plating is one of the key steps in the manufacture of computer thin film hard disk. The 12.5um thick Ni-P alloy layer is mainly deposited on the finely machined 5086 mg-Al surface to prepare for the subsequent vacuum sputtering magnetic recording film. The phosphorus content of the electroless nickel coating is 12%wt (atomic percentage is about 20.5%). The coating must be low stress and compressive stress. After heating at 250 ℃ or 300 ℃ for 1 h, it still remains non-magnetic, that is, the remanence is less than 0.1 × 10-4T. The coating must be uniform and smooth, and any defects and protuberances on the surface shall not exceed 0.025um. Because of the high technical requirements, it is necessary to use special electroless plating solution with high quality and high cleanliness, automatic plating control equipment and high cleanliness workshop environment. Electroless nickel plating on computer thin film hard disk is a typical representative of high-tech electroless nickel plating, which occupies an important market share.
The application of electroless nickel plating technology in microelectronic device manufacturing industry is growing rapidly. It is reported that Xerox has adopted selective Ni-P alloy electroless plating technology in the interconnection of VLSI multilayer chips and the filling and leveling of through holes (via-hole), and its products have passed the tests of shear strength, tensile strength, high and low temperature cycle and various electrical properties. The practice shows that the application of electroless nickel plating technology improves the technical economy of microelectronic device manufacturing process and the reliability of products.
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